Abstract: The lead frame is one of the key parts in integrated circuit,which supports core wafer,dissipates heat and connects with outer parts.Copper alloys have become important materials for making lead frames.as its excellent properties.The current status of research on lead frame materials at home and abroad is reviewed.covering the improvement of Cu-Ni-Si alloy with elements P,Cr and Ag alloy elements P,Cr and Ag to Cu-Ni-Si alloy in our recent research is discussed in this paper.