硅粉表面化学镀铜工艺研究

Process of Electroless Copper Plating on Si Powder

摘要: 研究了化学镀法对硅粉进行化学镀铜过程, 探讨了甲醛含量、pH值、温度对化学镀铜反应时间及复合粉体颜色的影响和镀层的微观形貌及结构。结果表明:在镀液中, pH值增大、温度升高、甲醛含量增加, 可以缩短反应时间, 提高镀速。得出最佳工艺条件:甲醛为60~72 ml/L, pH值为12~12.5, 60℃。所得复合粉体镀覆均匀, 晶形良好, 没有Cu₂O的存在。

Abstract: The process of electroless copper plating on Si was studied.The influences of formaldehyde content, pH, temperature on reaction time of copper electroless plating as well as the micro-morphology and structure of the deposit were analyzed.The results show that with increasing pH value, bath temperature and formaldehyde content, the reaction time is shortened and the plating rate is accelerated.The optimal conditions of the electroless copper plating process were obtained as temperature of 60~72ml/L of HCHO, pH value of 12~12.5 and temperature of 60℃.The surface of deposited coating is uniform.There are not Cu₂O existing in the deposit.