Cu-Fe基粉末烧结金刚石复合材料界面结合特性
Interfacial Bonding of Diamond and Matrix in Cu-Fe Powder Sintered Composite
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摘要: 以Cu-Fe基粉末为基体材料,在真空压力烧结条件下制备了金刚石复合材料。利用扫描电镜、能谱仪、X射线衍射仪等研究粉末与金刚石颗粒界面结合特性。结果表明,930℃、15MPa烧结温度和压力下,烧结胎体中Fe原子向金刚石表面扩散,形成一定厚度的扩散层,并与金刚石中的C发生化学反应生成Cfe15,呈非连续层片状分布于金刚石颗粒表面,实现了金刚石颗粒与金属的化学键结合。Abstract: Cu-Fe based diamond composite was sintered in a vacuum pressed sintering furnace,and Scanning Electron Microscopy,Energy Dispersive Spectrometer,X-ray Diffraction were used to investigate the bonding interface between diamonds and sintered matrix.The results showed that Fe atoms of the sintered matrix diffused to the diamond surface,and a certain thick diffusion layer of CFe15 had been formed between them under the conditions of sintering temperature 930 ℃ and pressure 15 MPa,the diffusion layer seems to distribute in a non-continuous layer form which achieve a chemical bond between diamonds and the sintered powder metal matrix.