一种应用于半导体的钽板制备工艺研究
A Research of Tantalum Plate Applied in Semiconductor Fabrication
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摘要: 磁控溅射吸附器应用于半导体制造的金属化工艺, 其作用是在溅射过程中起到聚焦和净化的作用。由于需要在表面进行均匀一致的滚纹处理, 所以对其坯料的板形以及同板差有非常严格的要求, 同时对内部组织也有较高要求。为了制备满足其要求的钽板, 本文主要从锻造工艺以及轧制工艺进行讨论, 最终得到适宜于批量生产的加工工艺, 使钽板满足小于0.15mm的同板差的要求, 同时晶粒尺寸在200~300μm之间, 并且均匀一致。Abstract: Magnetron sputtering absorber plays a role of focus and purification in sputtering process of in semiconductor manufacturing.Since proper texture and flatness and structure of the billet plate are essential to the uniform checkered surface treatment, forging and rolling process are mainly investigated in this paper and the uniform tantalum plate with thickness difference less than 0.15mm and grain size 200~300μm is producted.