Abstract: Effects of rolling conditions on peeling properties and peeling surface development of symmetrical cold roll bonding Cu/Al laminates were studied. Friction mechanism existing on the interface in deformation was analyzed.Results show that as the rolling reduction increases, both the bonding strength and the sticking virgin metal Al of the peeling surface increase, so does the crack density of Cu-side surface. The bonding strength of Cu/Al laminates reaches 2 N/mm when the rolling reduction is 50%, and as the rolling reduction increases to 60% and 70%, the bonding strength increases to 7 N/mm and 14 N/mm, respectively. During the rolling process, some underlying virgin metals are extruded between the cracks of the base metals, and interface friction promoting the good bonding of Cu/Al laminates.