外加磁场对H62铜合金大气腐蚀行为影响的仿真分析

Simulation of Applied Magnetic Field Effects on Atmospheric Corrosion of H62 Copper Alloy

  • 摘要: 针对机载电子设备面临的腐蚀与磁场耦合环境,本研究构建了腐蚀与磁场耦合仿真模型,研究外加磁场变化对H62铜合金在NaCl薄层液膜下的大气腐蚀行为影响机理。仿真结果表明:平行磁场通过洛伦兹力(FL)直接驱动带电离子向电极表面迁移,显著增加电解液流动与电化学反应速率,当磁感应强度为25 mT时,相较于垂直磁场,电解液流速由1.53 ×10-4 m/s增加至2.32 ×10-4 m/s,提升51.6%,电流密度由63.9 μA/cm2增加至136.0 μA/cm2,提升112.8%,且二者与磁感应强度呈线性正相关;垂直磁场则通过磁流体动力学效应(MHD)诱导电解液周向流动,虽减小了扩散层厚度,但对腐蚀的加速作用弱于平行磁场的,且磁感应强度超过15 mT后,磁场对腐蚀的加速效果随磁感应强度增加而减弱。研究结果揭示了磁场对腐蚀行为的差异化影响机制,为电子设备铜合金材料的腐蚀防护和电磁屏蔽设计提供了理论支撑。

     

    Abstract: The airborne electronic devices face the corrosive and magnetic field coupled environment in service. In this study, a corrosion-magnetic field coupling simulation model is established to investigate the influence mechanism of the applied magnetic field on the atmospheric corrosion behavior of H62 copper alloy under a NaCl thin electrolyte layer. The simulation results show that the parallel magnetic field drives charged ions to migrate toward the electrode surface through the Lorentz force (FL), significantly enhancing the flow rate of the electrolyte and electrochemical reaction rate. Compared with the perpendicular magnetic field, when the magnetic induction intensity of the the parallel magnetic field is 25 mT, the electrolyte flow rate increases from 1.53 × 10-4 to 2.32×10-4 m/s, the current density increases from 63.9 μA/cm2 to 136.0 μA/cm2, and both exhibit a nearly linear positive correlation with the magnetic induction intensity. The perpendicular magnetic field induces circumferential electrolyte flow via the magnetohydrodynamic (MHD) effect, reducing the thickness of the diffusion layer. The perpendicular magnetic field's accelerating effect on corrosion is weaker than that of the parallel magnetic field, and when the magnetic induction intensity exceeds 15 mT, the accelerating effect of the magnetic field on corrosion diminishes with increasing induction intensity. The finding reveals the differential influence mechanisms of magnetic fields on corrosion behavior, providing theoretical support for the corrosion protection and electromagnetic shielding design of copper alloy materials for electronic devices.

     

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