ITO靶材在磁控溅射过程中的结瘤诱因分析

Study on Nodule-forming Causes of ITO Target During Magnetron Sputtering

    摘要
  • 摘要: 研究了ITO靶材在磁控溅射过程中的结瘤问题,借助SEM对可能促使结瘤产生的因素进行了分析。结果表明,裂纹、孔隙等缺陷是结瘤产生的主要原因。

     

    Abstract: Causes of nodule formation ITO target during sputtering process were studied by SEM. The results showed that cracks, voids and other defects were the causes of nodule formation.

     

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