Effect of Different Surfactants and Content on Wettability of SAC305 Solder Paste
-
摘要: 为了提高Sn-Ag-Cu系无铅焊锡膏的润湿性,在助焊剂中加入表面活性剂降低焊料与Cu基板的界面张力,从而提高焊锡膏的润湿性。通过接触角测量仪、SEM和EDS研究离子型表面活性剂DDBAC和两性表面活性剂SDBAC含量对SAC305焊锡膏在Cu基板上的接触角、焊点宏观形貌和微观组织的影响。结果表明,添加表面活性剂可以减小焊料在基板上的接触角,且随着表面活性剂添加量的增加,接触角呈先减小后基本稳定。当SDBAC和DDBAC添加量(w)为0.6%时焊料的接触角最小,分别为10.0°和12.2°,且焊点圆润饱满,表明这两类表面活性剂均使焊锡膏表现出良好的润湿性。随着SDBAC和DDBAC添加量的增加,金属间化合物(IMC)层厚度显著增加,是因为表面活性剂通过表面改性显著提高了熔融焊料的扩散能力,促进IMC层的生长。Abstract: In order to improve the wettability of Sn-Ag-Cu lead-free solder paste, surfactants are added to the flux to reduce the interfacial tension between the solder and Cu substrate. The effects of DDBAC and SDBAC contents on the contact angle, solder joint morphology and microstructure of SAC305 solder paste are studied by means of contact angle measuring instrument, SEM and EDS. The results show that the addition of surfactants can decrease the contact angle of solder on the Cu substrate, and that with the addition content increases, the contact angle decreases first and then becomes stable. When the addition contents (mass fraction) of SDBAC and DDBAC are 0.6%, the contact angles are 10.0° and 12.2°, respectively, with the solder joints round and full, therefore, both surfactants make the solder paste show good wettability. With the increase of the DDBAC and SDBAC additions, the intermetallic compounds (IMC) layer thickens obviously for the surfactant significantly improves the diffusion of molten solder through surface modification.
-
Keywords:
- solder paste /
- wettability /
- surfactant /
- solder /
- contact angle /
- intermetallic compound
-
-
[1] 许国栋, 闫焉服, 高婷婷, 等. 松香含量对焊锡膏焊后残留及润湿性能的影响[J]. 焊接技术, 2022, 51(6): 70-74. [2] 李旭,付翀,王金龙,等. SnAgCu无铅焊膏用活性剂的优选研究.热加工工艺,1-6. https://doi.org/10.14158/j.cnki.1001-3814.20221456 [3] XU D X, LEI Y P, XIA Z D, et al. Experimental wettability study of lead-free solder on Cu substrates using varying flux and temperature[J]. Journal of Electronic Materials, 2008, 37(1): 125-133.
[4] ZHANG F W, HE H J, WANG Z G, et al. Solder paste metamorphism[J]. Rare Metals, 2021, 40(5): 1329-1336.
[5] ARENAS M F, HE M, ACOFF V L. Effect of flux on the wetting characteristics of SnAg, SnCu, SnAgBi, and SnAgCu lead-free solders on copper substrates[J]. Journal of Electronic Materials, 2006, 35(7): 1530-1536.
[6] WU C M L, LAW C M T, YU D Q, et al. The wettability and microstructure of Sn-Zn-RE alloys[J]. Journal of Electronic Materials, 2003, 32(2): 63-69.
[7] VAYNMAN S, FINE M E. Flux development for lead-free solders containing zinc[J]. Journal of Electronic Materials, 2000, 29(10): 1160-1163.
[8] LIU N S, LIN K L. The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu[J]. Scripta Materialia, 2006, 54(2): 219-224.
[9] 许国栋. 免清洗细间距无铅焊锡膏制备及性能研究[D]. 洛阳: 河南科技大学, 2022. [10] MHD N E E, MHD N N F, IDRIS S R A. A review: lead free solder and its wettability properties[J]. Soldering & Surface Mount Technology, 2016, 28(3): 125-132.
[11] YU D Q, XIE H P, WANG L. Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate[J]. Journal of Alloys and Compounds, 2004, 385(1-2): 119-125.
[12] GEBBIE M A, WEI W, SCHRADER A M, et al. Tuning underwater adhesion with cation-π interactions[J]. Nature Chemistry, 2017, 9: 473-479.
[13] 赵璐, 张蕾, 文欣, 等. 表面活性剂润湿低阶煤煤尘的性能及作用机理[J]. 西安科技大学学报, 2021, 41(2): 323-330. [14] 黄维刚, 胡夫, 刘楠琴. 表面活性剂对煤尘湿润性能的影响研究[J]. 矿业安全与环保, 2010, 37(3): 4-6. [15] 肖进新, 赵振国. 表面活性剂应用原理[M]. 2版. 北京: 化学工业出版社, 2015. [16] WANG H Q, ZHAO H, SEKULIC D P, et al. A comparative study of reactive wetting of lead and lead-free solders on Cu and (Cu6Sn5/Cu3Sn)/Cu substrates[J]. Journal of Electronic Materials, 2008, 37(10): 1640-1647.
[17] WHEELER S E, BLOOM J W. Toward a more complete understanding of noncovalent interactions involving aromatic rings[J]. 2014, 118(32): 6133-6147.
[18] PROTSENKO P, TERLAIN A, TRASKINE V, et al. The role of intermetallics in wetting in metallic systems[J]. Scripta Materialia, 2001, 45(12): 1439-1445.
[19] SEKULIC D P, ZHAO H, HADINATA P. Real time monitoring and modeling of reactive flow of molten metal through micro surface alterations during brazing[J]. DVS Berichte, 2007(243): 272.
[20] GOOD R J. Contact angle, wetting, and adhesion: a critical review[J]. Journal of Adhesion Science and Technology, 1992, 6(12): 1269-1302.
[21] CABARCOS O M, WEINHEIMER C J, LISY J M. Competitive solvation of K+ by benzene and water: cation-π interactions and π-hydrogen bonds[J]. The Journal of Chemical Physics, 1998, 108(13): 5151-5154.
[22] MOHD S M A A, MCDONALD S D, YASUDA H, et al. Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces[J]. Scripta Materialia, 2015, 100: 17-20.
[23] HUANG M L, YANG F, ZHAO N, et al. In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction[J]. Materials Letters, 2015, 139: 42-45.
[24] HUH J Y, HONG K K, KIM Y B, et al. Phase field simulations of intermetallic compound growth during soldering reactions[J]. Journal of Electronic Materials, 2004, 33(10): 1161-1170.
计量
- 文章访问数: 97
- HTML全文浏览量: 2
- PDF下载量: 5
下载:
