铜钢复合板弯片成形数值模拟与成形试验

孙少华, 董升朝, 任冠鹏, 邱胜闻, 郭宁

孙少华, 董升朝, 任冠鹏, 邱胜闻, 郭宁. 铜钢复合板弯片成形数值模拟与成形试验[J]. 材料开发与应用, 2021, 36(2): 39-43.
引用本文: 孙少华, 董升朝, 任冠鹏, 邱胜闻, 郭宁. 铜钢复合板弯片成形数值模拟与成形试验[J]. 材料开发与应用, 2021, 36(2): 39-43.
SUN Shaohua, DONG Shengchao, REN Guanpeng, QIU Shengwen, GUO Ning. Delamination Numerical Simulation and Stamping Test of Copper-Steel Clad Plate Half Bend[J]. Development and Application of Materials, 2021, 36(2): 39-43.
Citation: SUN Shaohua, DONG Shengchao, REN Guanpeng, QIU Shengwen, GUO Ning. Delamination Numerical Simulation and Stamping Test of Copper-Steel Clad Plate Half Bend[J]. Development and Application of Materials, 2021, 36(2): 39-43.

铜钢复合板弯片成形数值模拟与成形试验

详细信息
    作者简介:

    孙少华,男,1988年生,硕士,主要研究方向为有色金属制品加工工艺

  • 中图分类号: TG316

Delamination Numerical Simulation and Stamping Test of Copper-Steel Clad Plate Half Bend

  • 摘要: 铜钢复合钢板HALF弯片弯曲半径小,冲压成形变形量大,易出现复合界面开裂、脱层问题。采用ABAQUS三维有限元软件对HALF弯片热成形过程进行数值模拟,分析了600℃、700℃、800℃、900℃成形温度下弯片应力、弯片厚度及复合界面选定点应力,并进行了铜钢复合板HALF弯片热成形试验,测定复合界面结合率与剪切强度。结果显示:成形温度升高可以降低弯片成形应力和复合界面应力,对弯片厚度变化影响不大;铜钢复合板弯片经900℃加热冲压成形后,复合界面结合良好无脱层。
    Abstract: The copper-steel clad plate half bend has small bending radius and large stamping deformation, which can lead to crack and delamination of the composite surface. In this paper, the numerical simulation of half bend was carried out by ABAQUS finite element software, the thickness and stress of half bend at forming temperatures of 600℃, 700℃, 800℃ and 900℃ were analyzed. The forming experiment of copper-steel clad plate half bend was carried out. The results showed that increasing temperature could reduce half bend stress and interfacial stress, and had little effect on the thickness variation. When the copper-steel was half bend at 900℃, there was no delamination at the composite interface.
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出版历程
  • 收稿日期:  2020-03-25
  • 刊出日期:  2021-04-24

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