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Li Xiangfeng, Zuo Dunwen, Wang Min. Review on Improvement of Adhesion between Substrate and CVD Diamond Film by Using Interlayer[J]. Development and Application of Materials, 2000, 15(1): 35-39. DOI: 10.19515/j.cnki.1003-1545.2000.01.009
Citation: Li Xiangfeng, Zuo Dunwen, Wang Min. Review on Improvement of Adhesion between Substrate and CVD Diamond Film by Using Interlayer[J]. Development and Application of Materials, 2000, 15(1): 35-39. DOI: 10.19515/j.cnki.1003-1545.2000.01.009
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Review on Improvement of Adhesion between Substrate and CVD Diamond Film by Using Interlayer

  • Department of Mechanical Engineering, NUAA, Nanjing 210016, China

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  • Received Date: February 09, 1999
  • Available Online: June 16, 2024
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    • Abstract
  • Achievements on improving the adhesion strength of diamond film on substrate by introducing interlayer between them is reviewed in the paper. Diamond film can be deposited on many substrates by using interlayer such as Si, SiO2, SiC, Al2O3, Fe, WC-Co, and so on. The interlayer can be in form of monolayer as well as multilayer, such as DLC, C60, Y-ZrO2, C-N, TiC or TiN; Mo/Ni, Mo/TiN, B/TiB2/B. Different interlayer should be chosen with different substrate according to the lattice parameter and thermal coefficient to meet the demand of lattice and thermal matching.
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