Huang Wenbo, Meng Jilong, Li Zuojian. Joining of the Composite Overlay and the Surface of Al-Si Alloy Substrate[J]. Development and Application of Materials, 2000, 15(4): 1-4. DOI: 10.19515/j.cnki.1003-1545.2000.04.001
Citation: Huang Wenbo, Meng Jilong, Li Zuojian. Joining of the Composite Overlay and the Surface of Al-Si Alloy Substrate[J]. Development and Application of Materials, 2000, 15(4): 1-4. DOI: 10.19515/j.cnki.1003-1545.2000.04.001
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Joining of the Composite Overlay and the Surface of Al-Si Alloy Substrate

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  • By using braze welding and Zn-Al25 as brazing alloy, Al-9Si alloy clad with a thin layer of Al-Si-SiCP composite is successfully fabricated under protection atmosphere of N2. The properties of the interface are also investigated in this article.
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