YU Ping, MENG Qingsen, XUE Jin. Study of Anodic Bonding Between Al and K4 Glass[J]. Development and Application of Materials, 2003, 18(1): 23-27. DOI: 10.19515/j.cnki.1003-1545.2003.01.007
Citation: YU Ping, MENG Qingsen, XUE Jin. Study of Anodic Bonding Between Al and K4 Glass[J]. Development and Application of Materials, 2003, 18(1): 23-27. DOI: 10.19515/j.cnki.1003-1545.2003.01.007

Study of Anodic Bonding Between Al and K4 Glass

  • The anodic bonding in air between K4 glass and Al is investigated in this paper.It is found that the linear thermal expansion coefficient plays an important role in anodic bonding.The welding ability and influencing factors are analyzed during the bonding process between Al and K4 glass in air.Change in current has certain rule,which is described in this paper.The microstructure of the K4 glass-Al interface is investigated,and the result indicates that the composition of the interface is formed by Al2SiO3 and some other kinds of compound substances made up by Si, Al,Zn,O,Na and so on.
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