Study on the Preparation of Solder Powder in Surface Mounted Technology
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Graphical Abstract
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Abstract
A new type atomizer designed on the theory of Laval jet is tested in atomization experiment with 63A solder and Sn-Ag lead-free solder. The result indicates that the fine and ball shape solder alloy powder can be gotten by using the new atomizer with the melt temperature 400~450℃, the atomizing pressure 0.7~1.0MPa, meeting the requirement of surface mounted technology. It is found that the overtemperature of the solder alloy, atomizing pressure and oxygen content in atomizing environment are main factors to influence the particle size of the powder.
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