Volume 18 Issue 4
Jun.  2024
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Yu Xiliang, Zhao Maiqun, Zhang Weihua, Zhao Gaoyang. Study on the Preparation of Solder Powder in Surface Mounted Technology[J]. Development and Application of Materials, 2003, 18(4): 30-31,35. DOI: 10.19515/j.cnki.1003-1545.2003.04.009
Citation: Yu Xiliang, Zhao Maiqun, Zhang Weihua, Zhao Gaoyang. Study on the Preparation of Solder Powder in Surface Mounted Technology[J]. Development and Application of Materials, 2003, 18(4): 30-31,35. DOI: 10.19515/j.cnki.1003-1545.2003.04.009
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Study on the Preparation of Solder Powder in Surface Mounted Technology

  • School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048, China

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  • Received Date: January 02, 2003
  • Available Online: June 14, 2024
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    • Abstract
  • A new type atomizer designed on the theory of Laval jet is tested in atomization experiment with 63A solder and Sn-Ag lead-free solder. The result indicates that the fine and ball shape solder alloy powder can be gotten by using the new atomizer with the melt temperature 400~450℃, the atomizing pressure 0.7~1.0MPa, meeting the requirement of surface mounted technology. It is found that the overtemperature of the solder alloy, atomizing pressure and oxygen content in atomizing environment are main factors to influence the particle size of the powder.
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