Jia Hongxing, Liu Suqin, Huang Jinliang, Zhang Keke. The Research Progress of Lead-free Solders for Electronic Assembly[J]. Development and Application of Materials, 2003, 18(5): 42-46. DOI: 10.19515/j.cnki.1003-1545.2003.05.012
Citation: Jia Hongxing, Liu Suqin, Huang Jinliang, Zhang Keke. The Research Progress of Lead-free Solders for Electronic Assembly[J]. Development and Application of Materials, 2003, 18(5): 42-46. DOI: 10.19515/j.cnki.1003-1545.2003.05.012

The Research Progress of Lead-free Solders for Electronic Assembly

  • With the advance in micro-electronic and surface mount technology, the development of new non-toxic practical lead-free solders to replace the traditional Sn-Pb ones has become the focus of study recently. This paper reviews the necessity of using lead-free solders and the current status of lead-free solders. The development prospect is also forecasted.
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