LI Miao, YU Jian-sheng, JIANG Yu, CHEN Jia-zhao, TU Ming-jing. An Investigation on the Mechanism of Nano-copper Preparation with Ultrasonic Wave Electrodeposit[J]. Development and Application of Materials, 2004, 19(3): 12-15. DOI: 10.19515/j.cnki.1003-1545.2004.03.004
Citation: LI Miao, YU Jian-sheng, JIANG Yu, CHEN Jia-zhao, TU Ming-jing. An Investigation on the Mechanism of Nano-copper Preparation with Ultrasonic Wave Electrodeposit[J]. Development and Application of Materials, 2004, 19(3): 12-15. DOI: 10.19515/j.cnki.1003-1545.2004.03.004

An Investigation on the Mechanism of Nano-copper Preparation with Ultrasonic Wave Electrodeposit

  • The copper nano-powder with average size 30nm and good dispersity is prepared by means of ultrasonic wave electrodeposit.The composition, size, morphology and microstructure of the powder are analyzed with XRD, TEM etc, and the technical factors are optimized.The test results indicate that the electric current density dominates the forming of the nano-powder whereas the surface active agent and ultrasonic wave have great influence on scattering of the powder.
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