WANG Zhong-ping, ZHU Cheng-jun. Influence of NiCuMn on Interface of Diffusion Bonding C/Al[J]. Development and Application of Materials, 2004, 19(6): 1-3,12. DOI: 10.19515/j.cnki.1003-1545.2004.06.001
Citation:
WANG Zhong-ping, ZHU Cheng-jun. Influence of NiCuMn on Interface of Diffusion Bonding C/Al[J]. Development and Application of Materials, 2004, 19(6): 1-3,12. DOI: 10.19515/j.cnki.1003-1545.2004.06.001
WANG Zhong-ping, ZHU Cheng-jun. Influence of NiCuMn on Interface of Diffusion Bonding C/Al[J]. Development and Application of Materials, 2004, 19(6): 1-3,12. DOI: 10.19515/j.cnki.1003-1545.2004.06.001
Citation:
WANG Zhong-ping, ZHU Cheng-jun. Influence of NiCuMn on Interface of Diffusion Bonding C/Al[J]. Development and Application of Materials, 2004, 19(6): 1-3,12. DOI: 10.19515/j.cnki.1003-1545.2004.06.001
Influence of NiCuMn on Interface of Diffusion Bonding C/Al
The interface of diffusion bonding C/Al composite reinforced with Ni plated and NiCuMn multiplated high strength carbon fibers are investigted, the mechanism of Mn element enhancing the bond of C/Al interface is analyzed and a relationship of the thicknss δof interfacial active layer with fracture stress of the sample is estabished.