YUAN Wu-hua, YANG Shou-zhi, LIU Xing, YAN Xiao-ning, ZHANG Chen-chen, LI Ying-zhi. Effect of Die Forming Technologies on Microstructure and Properties of 7075/SiCp[J]. Development and Application of Materials, 2005, 20(3): 22-24,46. DOI: 10.19515/j.cnki.1003-1545.2005.03.007
Citation: YUAN Wu-hua, YANG Shou-zhi, LIU Xing, YAN Xiao-ning, ZHANG Chen-chen, LI Ying-zhi. Effect of Die Forming Technologies on Microstructure and Properties of 7075/SiCp[J]. Development and Application of Materials, 2005, 20(3): 22-24,46. DOI: 10.19515/j.cnki.1003-1545.2005.03.007
shu

Effect of Die Forming Technologies on Microstructure and Properties of 7075/SiCp

    Graphical Abstract
    • Abstract
  • The microstructure and properties of die-formed 7075/SiCp composites prepared by spray deposition were studied. The SiC distribution, microstructure of matrix alloy, densities and hardness of the compacts were depended on the pressing temperature. The SiC layers in deposite were eliminated, the differences of densities and hardness between the top and bottom of the compacts were lessened as the pressing temperatures rise, and as the temperature rise above 600℃, the hardness decreased markedly. The results show that the optimizing pressing temperature lies between 560℃ and 600℃.
    • FullText(HTML)
  • loading
    • References (0)
    • Related Articles

Catalog

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return