QIAO Dong-ping, ZHANG Fu-cheng. Probing Relations of SiO2 Aerogel’s Thermal Conduction Coefficient and Density[J]. Development and Application of Materials, 2010, 25(1): 38-40. DOI: 10.19515/j.cnki.1003-1545.2010.01.011
Citation: QIAO Dong-ping, ZHANG Fu-cheng. Probing Relations of SiO2 Aerogel’s Thermal Conduction Coefficient and Density[J]. Development and Application of Materials, 2010, 25(1): 38-40. DOI: 10.19515/j.cnki.1003-1545.2010.01.011
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Probing Relations of SiO2 Aerogel’s Thermal Conduction Coefficient and Density

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  • In this paper,the thermal conduction cubic model of SiO2 aerogel is founded in base of the thermal conduction plane model of double glass windows.Relations of SiO2 aerogel's thermal conduction coefficient and density are probed by the model.The calculational result and the test value are accordant.
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