WU Yan-fei, HUANG Ying. Research Progress of Room Temperature Cured Heat-resistant Adhesive[J]. Development and Application of Materials, 2010, 25(6): 88-93. DOI: 10.19515/j.cnki.1003-1545.2010.06.023
Citation: WU Yan-fei, HUANG Ying. Research Progress of Room Temperature Cured Heat-resistant Adhesive[J]. Development and Application of Materials, 2010, 25(6): 88-93. DOI: 10.19515/j.cnki.1003-1545.2010.06.023
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Research Progress of Room Temperature Cured Heat-resistant Adhesive

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  • The research prograss of heat-resistant adhesive cured at room temperature is reviewed in this essay.Several kinds of organic adhesives such as epoxy resin adhesive(EP) and organosilicon adhesive are introduced and some inorganic adhesives are involved.In the end,the development trends of the adhesive are put forward.
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