Research on Properties of Low-viscosity Vinyl Resin for RTM
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摘要: 对RTM用乙烯基树脂的工艺特性、树脂及其复合材料的力学性能进行了研究。该树脂具有较低的黏度,25℃时约为240 mPa·s。分析了树脂的凝胶时间,得出凝胶时间与温度的函数,其表观活化能较大,成型时应严格控制树脂温度。结合DSC曲线,分析了该乙烯基树脂在不同升温速率下的固化放热行为,得出树脂理论的凝胶温度、固化温度和后固化温度。该树脂及其复合材料均具有良好的力学性能。
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关键词:
- 树脂传递模塑(RTM) /
- 乙烯基树脂 /
- 低粘度 /
- 固化动力学 /
- 力学性能
Abstract: The process characteristics of vinyl resin for RTM and the mechanical properties of the resin and its composite materials are studied. The resin has a relatively low viscosity, about 240 mPa·s at 25℃. The gel time of the resin is analyzed, and the function of gel time and temperature is obtained. The apparent activation energy is relatively large, so the resin temperature should be strictly controlled in the process of molding. DSC curve is applied to analyze the curing exothermic behavior of the vinyl resin at different heating rates, and the theoretical gel temperature, curing temperature and post-curing temperature of the resin are obtained. The resin and composite materials have good mechanical properties.-
Key words:
- resin transfer molding(RTM) /
- vinyl resin /
- low viscosity /
- cure kinetics /
- mechanical properties
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