The Influence of Curing Condition on Adhesive Strength of Epoxy Resin Adhesive
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摘要: 研究了不同固化条件(温度、湿度)以及反应物配比对环氧树脂胶黏剂粘合强度的影响。结果表明,在使用环氧树脂胶黏剂粘接橡胶与金属基体时,固化条件对其粘接效果产生了显著影响。当温度为25 ℃,环氧树脂胶黏剂在湿度小于55%时粘合强度较高,湿度过高,粘合强度会明显下降,说明过于潮湿的环境不利于环氧树脂胶黏剂的应用。当湿度为55%,环氧树脂胶黏剂在20~25 ℃时粘合强度较高,当温度升高或者降低至10 ℃时,粘合强度都会有明显下降。Abstract: The influence of different curing conditions (temperature, humidity) and reactant ratio on the adhesive strength of epoxy resin adhesive were studied. The result shows that curing conditions have a significant influence on the bonding effect of epoxy resin adhesive between rubber and metal matrix. When the temperature is 25 ℃, the adhesive strength of epoxy resin is the highest in the range of humidity less than 55%. When the humidity is higher, the adhesive strength will obviously decrease, and too humid environment is not conducive to the application of epoxy resin adhesives. When the humidity is 55%, the adhesive strength of epoxy resin is higher in the range of 20 ℃~25 ℃. When the temperature is increased to 40 ℃ or reduced to 10 ℃, the adhesive strength will be reduced.
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Key words:
- epoxy resin adhesive /
- curing conditions /
- adhesive strength
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