Abstract: Achievements on improving the adhesion strength of diamond film on substrate by introducing interlayer between them is reviewed in the paper. Diamond film can be deposited on many substrates by using interlayer such as Si, SiO₂, SiC, Al₂O₃, Fe, WC-Co, and so on. The interlayer can be in form of monolayer as well as multilayer, such as DLC, C₆₀, Y-ZrO₂, C-N, TiC or TiN; Mo/Ni, Mo/TiN, B/TiB₂/B. Different interlayer should be chosen with different substrate according to the lattice parameter and thermal coefficient to meet the demand of lattice and thermal matching.