Abstract: The microstructure and properties of oxide dispersion strengthened copper ODS 20 is investigated in this paper.It is indicated that the Al₂O₃ patricles with a size about 10 nanometer grow in-situ in the copper base in the process of internal oxidation.The conductivity of the material is about 90% IACS or 10% lower than that of pure copper and the strength of the material in room temperature reaches 610MPa.After heating at 1173K for 1.5 hour,the hardness retains 86%,which indicates that the soft point of the material is higher than 1173K and when the material is heated at 1273K for 1.5 hour,the average grain size of the material is smaller than 1μm without the melting,coalescing and growing of the Al₂O₃ particles.