Research on Aging of Cu-Ni-Si Alloy With Orthogomal Test
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摘要: 采用正交试验对Cu-3.2Ni-0.75Si-0.3Zn合金的时效工艺进行了研究。结果发现,各因素对合金导电率和显微硬度影响程度的主次顺序分别为:时效温度>合金状态>时效后冷变形量>时效时间和时效温度>冷变形量>合金状态>时效时间。在保证合金性能不降低的情况下,该合金热轧板材经60%冷变形后,可直接进行时效而省去固溶处理。合金经最佳工艺时效和60%冷变形后,导电率和显微硬度分别可达41.96%I-ACS和263.4Hv。
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关键词:
- Cu-Ni-Si合金 /
- 正交试验 /
- 时效 /
- 显微硬度 /
- 导电率
Abstract: Influence of technological factors on the aging of Cu-3.2Ni-0.75Si-0.3Zn alloy was investigated with orthogonal test.It was founded that the sequence affecting electric conductivity and micro-hardness is as follows: aging temperature>alloy's state>degree of cold deformation>aging time and aging temperature>degree of cold deformation>alloy's state>aging time.The alloy can be direct aged after 60% cold deformation without solution and the properties will not be deteriorated.After proper aging and 60% cold deformation,the electric conductivity of the alloy reaches 41.96%IACS and the micro-hardness reaches 263.4Hv.-
Key words:
- Cu-Ni-Si alloy /
- Normal experiment /
- Aging /
- Micro-hardness /
- Electric conductivity
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