Anti-oxidation Technique of Conductive Ultrafine Copper Powder
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摘要: 利用自制的防氧化剂对已氧化超细铜粉表面改性,研究了氧化层去除和包覆工艺。结果表明,以5%硫酸作为酸洗剂,防氧化剂浓度为0.1%~0.5%,反应温度为60℃时,铜粉红外反射谱图中有防氧化剂特征峰,XRD和XPS分析结果表明,所得铜粉表面不含氧化物,防氧化剂在铜粉表面生成一层厚度适中的保护膜,隔绝了铜粉与环境的接触,不影响导电性,并且该保护膜在150℃以下以及5%H2SO4、5%NaOH和5%NaCl溶液介质中稳定。Abstract: Oxidized copper powder was coated with an antioxidant which was self-made in the laboratory.The mechanism of the oxides removal from and the coating of the ultrafine oxidized copper power were investigated.IR,XRD and XPS analyses results showed that after pickled with 5% H2SO4 and dipped in 0.1%~0.5% anti-oxidant solution at 60℃ for a proper period of time,the surface of the powder was covered with a protective anti-oxidant film which will prevent the surface from environment attach,but don't affect the conductivity of the powder and the film is stable under 50℃ in 5% H2SO4,5%NaOH and 5% NaCl solutions.
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Key words:
- Ultrafine copper powder /
- Oxidation resistance /
- Conductivity
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