FENG Wei. A Study on Curing Kinetics of Epoxy System by DSC[J]. Development and Application of Materials, 2013, 28(3): 69-71. DOI: 10.19515/j.cnki.1003-1545.2013.03.016
Citation:
FENG Wei. A Study on Curing Kinetics of Epoxy System by DSC[J]. Development and Application of Materials, 2013, 28(3): 69-71. DOI: 10.19515/j.cnki.1003-1545.2013.03.016
FENG Wei. A Study on Curing Kinetics of Epoxy System by DSC[J]. Development and Application of Materials, 2013, 28(3): 69-71. DOI: 10.19515/j.cnki.1003-1545.2013.03.016
Citation:
FENG Wei. A Study on Curing Kinetics of Epoxy System by DSC[J]. Development and Application of Materials, 2013, 28(3): 69-71. DOI: 10.19515/j.cnki.1003-1545.2013.03.016
Curing kinetics of epoxy system was studied by DSC under nonisothermal conditions.The curing process of the resin system was determined.Apparent activation energy and the reaction series of the resin were calculated by using Kissinger and ozawa methods to be 53.65 kJ/mol and 0.886 respectively.
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