Volume 36 Issue 2
Apr.  2021
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SUN Shaohua, DONG Shengchao, REN Guanpeng, QIU Shengwen, GUO Ning. Delamination Numerical Simulation and Stamping Test of Copper-Steel Clad Plate Half Bend[J]. Development and Application of Materials, 2021, 36(2): 39-43.
Citation: SUN Shaohua, DONG Shengchao, REN Guanpeng, QIU Shengwen, GUO Ning. Delamination Numerical Simulation and Stamping Test of Copper-Steel Clad Plate Half Bend[J]. Development and Application of Materials, 2021, 36(2): 39-43.
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Delamination Numerical Simulation and Stamping Test of Copper-Steel Clad Plate Half Bend

  • Luoyang Ship Material Research Institute, Luoyang 471023, China

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  • Received Date: March 25, 2020
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    • Abstract
  • The copper-steel clad plate half bend has small bending radius and large stamping deformation, which can lead to crack and delamination of the composite surface. In this paper, the numerical simulation of half bend was carried out by ABAQUS finite element software, the thickness and stress of half bend at forming temperatures of 600℃, 700℃, 800℃ and 900℃ were analyzed. The forming experiment of copper-steel clad plate half bend was carried out. The results showed that increasing temperature could reduce half bend stress and interfacial stress, and had little effect on the thickness variation. When the copper-steel was half bend at 900℃, there was no delamination at the composite interface.
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    • References (6)
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